India, US ink pact to set up semiconductor fab for national security, next-gen telecom

India and the US have entered into an agreement to set up a semiconductor fabrication plant to make chips for use in “national security, next generation telecommunications and green energy applications”, according to the Indo-US joint fact-sheet.

Both US President Joe Biden and Prime Minister Narendra Modi hailed the “watershed arrangement”, the first such project where the US Military has agreed to a partnership on highly valued technology with India.

The fab, focused on “advanced sensing, communication and power electronics”, will be enabled by support from the India Semiconductor Mission as well as a strategic technology partnership between Bharat Semi, 3rdiTech, and the US Space Force, the statement said. “It will be established with the objective of manufacturing infrared, gallium nitride and silicon carbide semiconductors,” it added.

Source: Financial Express